Thomas Brunschwiler is a research staff member of the Advanced Micro Integration team at IBM Research - Zurich. He conducts physical research and coordinates governmental (e.g. HyperConnect, CarrICool) and joint projects.
In this respect he is currently pushing the frontiers in 3D integration with respect to scalable heat removal and power delivery, supporting performance and efficiency scaling of high end servers.
In this context he performed his Ph.D. in Electrical Engineering at the Technical University of Berlin, entitled "Interlayer Thermal Management of High-Performance Microprocessor Chip Stacks".
He joined IBM Research in 2001, exploring integrated photonic devices and organic light emitting diodes. He received his Master's Degree in Microsystemtechnology from the Interstate University of Applied Science Buchs in 2001 for his work on "Facet emitting laser diode beam combiner".
Thomas Brunschwiler has authored and co-authored over 50 publications, one book chapter and over 25 patents. He received three best paper awards at ITHERM and SEMI-THERM and was honored in 2009 with the Harvey Rosten Award for Excellence in the Physical Design of Electronics".
He is currently in the technical committee of ITHERM, InterPack and is an Senior IEEE member.