Professional AssociationsProfessional Associations: IEEE | IEEE Components, Packaging and Manufacturing Technology Society | International Microelectronics And Packaging Society - IMAPS
Dr. Yang Liu is a research scientist at IBM TJ Watson Research Center.
He received Bachelor in EE, Bachelor in CS from Zhejiang University, China, Master degree in Microsystem Integration Technology from Chalmers University of Technology, Sweden. He received PhD in EE from the University of Arkansas and joined IBM in 2009. Dr. Liu has worked on 3D Technology for more than 10 years. He works in Cu TSV, assembly and cooling. He leads fine-pitch 3D Test Research team from 2010.
He received Best Student Paper Award in IMAPS2008 and DPC2008, and Most Inspirational Presentation Award in SWTW2014.
He was an invited speaker at ITC2015 and NATW 2016.