Xiaoxiong Gu (Kevin) received the B.S. degree from Tsinghua University, Beijing, China, in 2000, and the Ph.D. degree from the University of Washington, Seattle, in 2006, both in electrical engineering. He joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on optoelectronic and mm-wave packaging, electrical designs, modeling, simulation and characterization techniques for communication and computation systems. He has worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including on-chip and off-chip interconnects. He is involved in developing novel TSV and interposer technologies for heterogeneous system integration. His current work includes developing V-band and W-band phased array systems based on circuit-package-antenna co-design.
Dr. Gu has authored and co-authored over 60 technical papers and 7 patents. He received the IEEE EMC Symposium Best Paper Award in 2013, SRC Mahboob Khan Outstanding Industry Liaison Award in 2012, IBM First and Second Plateau Invention Awards in 2012 and 2013, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Session Paper Award at IEEE ECTC in 2007, and the Best Interactive Session Paper Award at IEEE DATE in 2008. Dr. Gu is the chair of Professional Interest Community (PIC) of Electrical Interconnect and Packaging at IBM. He is a Senior Member of IEEE and currently serves on the technical program committee for EPEPS, ECTC and DesignCon.