Peilin Song  Peilin Song photo       

contact information

Manager, Circuit Test and Diagnostics Technologies
Thomas J. Watson Research Center, Yorktown Heights, NY USA


Professional Associations

Professional Associations:  IEEE Circuits and System Society  |  IEEE Computer Society


Peilin Song is a Research Staff Member at the IBM Thomas J. Watson Research Center, where he is a manager of the Circuit Diagnostics and Testing Technology department. He joined IBM in 1997 and has since worked in the area of design for testability, fault diagnostics, fault modeling, circuit simulation, optical testing and diagnostics, and recently hardware security. He has 80+ publications, holds 37 U.S. patents with several patents pending. In 2004, he has won the IEEE Electron Device Society Paul Rapparport Award. Also, in 2006, he received an Outstanding Contribution Award from the IEEE Computer Society. He received his Ph.D. in electrical engineering from the University of Rhode Island.

Research Interests

Peilin leads a research group in focusing on exploring and developing innovative test methods and techniques that aid in developing leading edge technology and circuits during early development phase as well as diagnostic and performance testing on high impact IBM Research and Server/Technology Group projects from single device parameters to complex microprocessors. Also, the team is collaborating with tool vendors, universities, and government agencies to advance diagnostic testing tools , and methods/methodologies for the industry. In particular, he drives the IBM optical testing development strategy, especially, the PICA (Picosecond Imaging Circuit Analysis) development. Recently, he directs IBM's effort in developing the next generation optical diagnostics tools for 14nm technology node and beyond. In addition, Peilin has developed a novel hardware Trojan detection technique for chip security using the intrinsic light emission from the powered-on device and novel methodology and test system to enable the early detection and precise localization of Time-Dependent-Dielectric-Breakdown (TDDB) occurrence in Back-End-of-Line (BEOL) interconnection. He also worked on projects that developed various on-chip sensors .

Currently,the other projects in my group include: (1) 3D integrated circuit test development and characterization; 2) Design and measurement of graphene FETs and integrated graphene RF circuits; 3) Thermal imaging and analysis of microprocessors; 4) MRAM test development and characterization; 5) On-chip Voltage Regulator test and characterization; 6) High speed measurement method development for manufacturing test; 7) Test method development for fast IC reliability assessment.