Evan G. Colgan received a BS in Applied Physics from Caltech in 1982 and a PhD in Materials Science from Cornell in 1987. Dr. Colgan joined IBM in 1987 and worked on silicides, selective CVD-W, diffusion barriers, and both Cu- and Al-based chip wiring. He transferred to IBM Research as a Research Staff Member in 1995 to manage the TFT processing dept, and subsequently worked on a number of display related projects. He joined the packaging area in 2001 and has worked on optical packaging, high performance liquid cooling, super computer packaging, and 3D chip packaging. Dr. Colgan has over 100 technical publications, over 100 issued US patents, and is a member of APS, MRS, Sigma Xi, and a Senior Member of IEEE.