David Abraham

Overview

David Abraham

Title

Principal RSM, Quantum Hardware, Sub-theme lead, Advanced Packaging and Modularity

Location

IBM Research - Yorktown Heights Yorktown Heights, NY USA

Bio

I've worked on a wide variety of topics since joining IBM, including near-field microscopy, thermal imaging for disk drive application, MRAM and now quantum computing. My most recent work focuses on practical aspects of the technologies related to quantum computing, including the development of superconducting bump bonds, TSVs, multi-level wiring and applications into complete builds such as the recent 127 qubit Eagle device.

Publications

Patents

Top collaborators