Dongsoo Lee received the B.S. and M.S. degrees in electrical engineering from the Korea Advanced Institute of Science and Technology, Daejeon, Korea, and the Ph.D. degree in electrical and computer engineering from Purdue University, West Lafayette, IN, in 2002, 2004, and 2013, respectively.
He was with Samsung Electronics, Ltd., Suwon, Korea, from 2004 to 2008, where he was involved in research on designing circuits for DTV one-chip solutions. In the summer of 2011, he worked as a graduate intern at Qualcomm Incorporated, San Diego, CA. In the summer of 2012, he worked as a graduate intern at Intel Corporation, Hillsboro, OR. He has been with IBM T. J. Watson Research Center as a Research Staff Member since July 2013. His current research interests include low power design, on-chip memory design, and design for test.