Daniel C Edelstein  Daniel C Edelstein photo       

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IBM Fellow; Manager: Processes, Materials, & Integration
Thomas J. Watson Research Center, Yorktown Heights, NY USA
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Professional Associations

Professional Associations:  IEEE Electron Devices Society (EDS)  |  National Academy of Engineering

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IBM Fellow and Manager, MRAM Manufacturability.  Career work has focused on CMOS on-chip Cu-based interconnection technologies, including integration with low-k/ultralow-k dielectrics, reliability physics, performance modeling and measurement, and evaluation of new materials and integration schemes.  Led other projects, including: "2.5D" Si Carrier with through-Si vias for 3D integration; Quantum Computing processes, integration, and interconnects; and currently MRAM technology manufacturability.