- Computational Biology Center
- Computational Genomics
- Genomic Medicine
- Large Block and Structured Synthesis (LBSS)
- Wire Synthesis
- Electrical Engineering
- Algorithms and Theory
- Artificial Intelligence
- Computational Biology
- Design Automation
- Healthcare Informatics
- VLSI Design
Cliff Sze is a research staff member at the IBM T. J. Watson Research Center
and the Austin Research Laboratory, where he works on data management system for health care analytics (e.g. genomic data and medical images), as well as VLSI EDA.
In the area of healthcare analytics, he is interested in genomics pipeline and metadata management. He is currently leading the effort to build the next generation provenance and metadata database system based on noSQL technologies.
In the area of VLSI EDA, he focuses on integrated placement, routing, clocking and timing optimization for ASIC and microprocessor designs. Cliff has contributed to several IBM ASIC designs, as well as POWER 6, POWER 7, Xbox 360 and the Sony/Toshiba/IBM CELL processors for PlayStation consoles. He received several IBM technical/invention awards, filed more than 30 patents applications and was granted 15+ patents. His research interests include design and analysis of algorithms, computer-aided design technique for very large scale integration, physical design, and performance-driven interconnect synthesis. He received his B.Eng. and M.Phil. degrees from the Department of Computer Science and Engineering, the Chinese University of Hong Kong and his Ph.D. degree in computer engineering at the Department of Electrical Engineering, Texas A&M University.
Being a senior member of IEEE and ACM, Dr. Cliff Sze has been actively serving the academic/research community, for example, serving as the general chair of International Symposium on Physical Design 2014, and being appointed as an associate editor for ACM Transactions on Design Automation of Electronic Systems (TODAES). He is a recipient of the ACM Special Interest Group on Design Automation (SIGDA) technical leadership award.