Professional AssociationsProfessional Associations: IEEE Member | Japan Institute of Electronics Packaging
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Keishi Okamoto received his M.S in Informatics from Kyoto University in 2003. His research topic in the university was a technique for developing a precise thermal compact model.
In 2003, he joined IBM Japan. He contributed to the advanced packaging development through mechanical modeling and testing for optimized material design and structures.
Since 2011, he joined IBM Research -Tokyo. Current focus research area is organic interposer development with ultra high density circuitry for neuromorphic chips.