Paul Fortier is an Advisory Engineer in the packaging development organization at IBM Bromont (Quebec, Canada). He is currently leading the packaging development activities for IBM's silicon nanophotonic occurring at the C2MI research center in Bromont.
He received the B.Eng degree in mechanical engineering from McGill university (Montreal) in 1988. In 1989, he joined IBM as a systems engineer working in the technical marketing group in Montreal, before moving to the IBM Bromont manufacturing / development site in 1992. Since then, he has worked as a process development engineer and project manager in the fields of wirebond and flip chip packaging assembly, wafer dicing and well as optoelectronic packaging assembly. He hold 20+ patents related to the packaging assembly field. In 2011, IBM Bromont made silicon nanophotonic packaging a focus item, and Paul has lead this development team since that time.
Paul is an avid sportsman with passions in running, biking (road, x-country, downhill) and skiing (x-country, downhill) and trains and competes in triathlons, duathlons, and pentathlons.