Nicolas (N.) Boyer  Nicolas (N.) Boyer photo       

contact information

Development Engineer - Bond & Assembly
  +1dash450dash534dash7914

links


profile


Advanced Semiconductor Packaging - Process Development Engineer

  • Flip chip process development
  • 3D and multi-chip modules packaging development and qualifications
  • Si photonics packaging
  • Process engineering - process and control
  • Lean manufacturing
  • Mechanical Characterization
  • Failure analysis